SUN-2100N is suitable for protecting metal substrates such as aluminum in the manufacturing process of power devices. In the manufacturing process of power devices, thin metal layers such as aluminum need to be corroded, and xylene photoresist is used in the traditional process. This type of photoresist is not only toxic, but also generates a large amount of organic waste liquid during use. Petroleum ether has a flash point of -20 °C and is used as a developer with a risk of explosion. Concentrated nitric acid is often used to strip KTFR and is a safety hazard. SUN-2100N was independently invented and invented by Startech. It is completely non-toxic and can effectively protect aluminum and other metal substrates. SUN-2100N is developed with standard TMAH (2.38%) and fixed with pure water, which is environmentally friendly and safe. Organic solvent replaces concentrated nitric acid to strip photoresist.