SUN-WB12160 is Startech's innovative temporary bonding adhesive product, which can firmly bond the wafer to be processed and the carrier. After the processing is completed, the wafer is separated from the carrier by a method of baking and heating. This series of products includes two categories of low temperature and high temperature debonding, which can be cleaned quickly and cleanly after debonding. Startech temporary bonding glue is especially suitable for wafer thinning process, used in 3D packaging and MEMS processing. After the bonding, thinning, photolithography, etching and other procedures are completed, the wafer is separated from the carrier by thermal slip. During ultra-thin wafer processing, SUN-WB12160 exhibits excellent rheology, thermal stability, chemical resistance and bond strength.